Description
Chemical composition (nom.)
– Cu 78-82 %
– Pb 8-11 %
– Sn 9-11 %
Max. impurities
– Ni 2,0 % (can be part of the Cu-content)
– P 0,05 %
– Zn 2,0 %
– S 0,10 %
– Fe 0,25 %
– Mn 0,2 %
– Al 0,01 %
– Si 0,01 %
– Sb 0,5 %
Mechanical properties (nom.)
Yield strength (Rp N/mm²): 105-140 N/mm²
Tensile strength (Rm N/mm²): 210-255 N/mm²
Elongation in % A 5: 8-14%
Hardness/Brinell: ≥ 70 HB                                                                                      Density ∼ 8.9
Mating material: Min. surface hardness 200 HB. Rec. surface roughness <1 Ra
Characteristics                                                                                                       The material is not suitable for welding. The material is suitable for soldering and brazing. The material is also suitable for bonding.